ISD-V330 Gateway
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Rugged in-vehicle gateway with multi-WAN connectivity
- Intel Atom x6425E processor (Elkhart Lake)
- 1x DDR4 3200 MT/s SODIMM slot up to 32 GB with In Band ECC
- 3x Removable PGN Series Caddy, 1x M.2 3042 B-Key socket with dual nano-SIM slot for 4G/LTE, 1x M.2 2230 E-Key socket for WiFi
- 2x GbE RJ45, 3x USB 2.0, 1x USB 3.0, 2x HDMI, 1x TPM 2.0 2x RS232/422/485, 1x CAN 2.0, 4x DIO isolation
- eMMC 64 GB up to 128 GB storage, 1x SATA
- Operating temperature: -40 ~ 70ºC
Description
Product Details
The ISD-V330 is a fanless rugged Multi-WAN in-vehicle gateway featuring IoT-enhanced CPU, with rich I/O functionality and environmental endurance, making it highly applicable in smart bus evolution. ISD-V330 features the new generation 10 nm process SoC (System-on-Chip) Intel Atom x6425E processor (codenamed Elkhart Lake). This processor consumes low volume of power and delivers the required performance for vehicle computing needs, such as vehicle controls, fleet monitoring, and management systems that synchronize inputs from multiple sensors and direct actions in semiautonomous buses, trains, ships, and trucks.
ISD-V330 offers expandable functionality. It boasts an abundance of I/O peripheral connectivity including 1 CAN bus and 2 serial COM ports, 2 video output by HDMI, USB and MIO ports, 2 RJ-45 GbE LAN ports and SATA/mSATA storage options. To achieve multi-WAN aggregate wireless network connectivity, ISD-V330 offers 3 PGN removable caddy with dual SIM slot supporting 4G-LTE/5G cellular communications. In addition, the compact system comes with a native CAN bus for concerns of driving behavior analysis. ISD-V330 is compliant with E13, UL/cUL 62368-1 standard and passes MIL-STD-810G shock and vibration resistance certifications to ensure proper operations when traveling on non-flat surfaces. Temperature is another concern for in-vehicle installation. Therefore, ISD-V330 is built to support wide temperature range, from -40°C to 70°C.
Specifications
Processor System
| CPU | Intel Atom x6425E processor |
| Frequency | 2.0 GHz |
| Core Number | Quad-core |
| BIOS | AMI SPI Flash BIOS |
| Chipset | SoC |
| Processor Graphics | Intel UHD Graphics |
Fanless
| Yes |
Memory
| Technology | DDR4 3200 MT/s SODIMM with In Band ECC |
| Max. Capacity | 32 GB (Default 4 GB) |
| Socket | 1x 260-pin SODIMM |
Ethernet
| Controller | Intel i210IT |
| Interface | 2x GbE RJ45 |
Storage
| Type | SATA |
| Installation | 1x SATA (reserved) |
| Type | eMMC |
| Installation | Onboard eMMC 64 GB up to 128 GB |
I/O
| Display | 2x HDMI with screw lock |
| CAN | 1x CAN 2.0 (option for J1939/J1708) |
| COM | 2x RS-232/422/485 |
| USB | 3x USB 2.0, 1x USB 3.0 Type A |
| GNSS/G-sensor | u-blox NEO-M8N/ADXL 345 |
| Digital I/O | 4x digital input with isolation, 5-30 V/100 mA, 4x digital output with isolation, 30 V/ 2 A dry relay configurable either N.C. or N.O., 1x IGN_DI to MCU |
| Antenna | 6x SMA antenna hole (includes GNSS) |
Expansion
| M.2 | 1x M.2 3042 B key Socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E key Socket for Wi-Fi |
Cooling
| Processor | Passive CPU heatsink |
| System | Fanless design with corrugated aluminum |
Environment
| Operating Temperature | -40 ~ 70°C / -40 ~ 158°F |
| Storage Temperature | -40 ~ 85°C / -40 ~ 185°F |
| Relative Humidity | 5% ~ 90% @ 40°C / 104°F (storage level) |
Miscellaneous
| Hardware Monitoring | Yes |
| Internal RTC with Li battery | Yes |
Mechanical
| Dimension (W x H x D) | 273.8 x 73 x 185 mm (10.78” x 2.87” x 7.28”) |
| Weight | 4 kg |
| Mounting | Wall mount kit |
Power
| Input | Supports DC 9 ~ 36V (12/24V) level, support ignition delay on/off control |
| Connector | 3-pin terminal block (+,-,ignition) |
| Power Consumption (Idle) | 16.8 W |
| Power Consumption (Full Load) | 21.5 W |
Driver Support
| Microsoft Windows | Windows 10 IoT Enterprise |
| Linux | Linux Kernel 5.4 |
Certification
| CE/FCC Class A, E24, UL/cUL 62368-1, MIL-STD-810G anti vibration & shock |